Bottom price Conductive Silver Powder - Spherical Alumina Powder for Thermal Interface Materials – Huarui

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Bottom price Conductive Silver Powder - Spherical Alumina Powder for Thermal Interface Materials – Huarui Detail:

Product Description

HRK series spherical alumina are produced by high temperature melting-jet method developing on ordinary irregular shape Al2O3, and then undergoes screening, purification and other processes to obtain the final product. The obtained alumina has high spheroidization rate, controllable particle size distribution and high purity. Because of its unique properties such as high thermal conductivity and good mobility, The product have been widely used as the filler of thermal interface materials, thermal engineering plastics and aluminum-based Copper-Clad Laminates and so on.

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Product Features

Technical item		Unit	HRK Series product Code
Particle Size			HRK-1	HRK-2	HRK-5	HRK-10	HRK-20	HRK-30	HRK-40	HRK-70	HRK-90	HRK-120
	(D10)	µm	0.71	0.69	2.54	4.55	10.5	16.88	23.77	44.32	55.23	92.39
	(D50)	µm	1.08	2.18	5.52	10.43	20.8	30.52	41.54	71.54	87.96	122.98
	(D90)	µm	3.21	5.24	9.09	20.8	37.24	48.87	66.44	106.5	134.92	172.07
Specific Surface Area		m2/g	1.69	1.27	0.36	0.17	0.14	0.13	0.12	0.12	0.1	0.06
Electrical Conductivity		u S/cm	6.07	5.4	5.65	4.05	6.87	7.95	4.65	6.18	8.15	6.45
PH Value		-	7.53	7.79	7.7	7.9	7.62	7.7	7.8	7.7	7.9	7.54
Moisture		%	0.05	0.03	0.03	0.03	0.03	0.03	0.03	0.03	0.03	0.04
True Density		g/cm3	3.71	3.7	3.74	3.76	3.79	3.79	3.81	3.87	3.88	3.89
Spheroidization Rate		%	96	98	98	98	96	98	96	96	95	95
Chemical Composition	Al2O3	%	99.87	99.94	99.89	99.94	99.92	99.93	99.94	99.92	99.94	99.92
	SiO2	ppm	430	30	430	20	150	20	20	30	20	170
	Fe2O3	ppm	140	70	140	40	60	60	50	60	60	140
	Na2O	ppm	90	100	10	60	140	90	110	90	70	90

Application

● Thermal Interface Materials: thermal silica pad, thermal grease, thermally conductive potting glue, phase change materials;
● Thermally Conductive Engineering Plastics: LED lamp cover, switch shell,electronic products shell, electrical products heat dissipation parts;
● Al-based Copper Clad Laminate: high-power LED circuit substrate, power circuit boards, etc;
● Alumina Ceramic Filters;
Thermal Spray Coating.

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