Boron Nitride

Boron Nitride

Short Description:

  • Product Name: Boron Nitride powder
  • Package: aluminium foil bag
  • Color: white
  • Shape: powder
  • CAS: 10042-11-5
  • Main application: Electronic Packaging ; Thermal Interface Materials
  • MOQ: 10kg
  • Place of Origin: Sichuan,China
  • Product Detail

    Product Description

    Boron nitride has the characteristics of hardness, high melting point, corrosion resistance and high thermal conductivity, which makes it widely used in many fields. The hardness of boron nitride is very high, similar to diamond. This makes boron nitride ideal for manufacturing high-hardness materials, such as cutting tools, abrasives, and ceramic materials. Boron nitride has excellent thermal conductivity. Its thermal conductivity is about twice that of metal, making it an ideal material for high temperature applications. Boron nitride is often used as a heat dissipating material and can cope with high temperature and high pressure environments. Boron nitride also has good chemical stability and corrosion resistance. It can resist the corrosion of acids, bases and most organic solvents, so it is widely used in the chemical industry and the petroleum industry.


    技术指标 Technical Item 单位 Unit HRBN系列产品编号/HRBN Series Product Code 方法/设备 Method/Device
    HRBN-30 HRBN-60 HRBN-100 HRBN-120 HRBN-160 HRBNL-120 HRBNL-200 HRBNL-250
    粒度分布 Particle Size (D50) µm 30 65 100 120 180 120 200 260 Light Scattering P-9 Light Scattering/OMEC TopSizer
    比表面积 Specific Surface Area m2/g ≤4 ≤4 ≤4 ≤4 ≤4 ≤4 ≤4 ≤4 3H-2000A Specific Surface Area Anylyer
    电导率 Electrical Conductivity µS/cm ≤100 ≤100 ≤100 ≤100 ≤100 ≤100 ≤100 ≤100 Mettler FE-30 Conductivity Meter
    pH Value - ≤10 ≤10 ≤10 ≤10 ≤10 ≤10 ≤10 ≤10 Mettler FE-20 pH Meter
    振实密度 Tapped Density g/cm3 0.3 0.45 0.45 0.45 0.45 0.35 0.37 0.37 BT-303
    BN % ≥99.3 ≥99.3 ≥99.3 ≥99.3 ≥99.3 ≥99.3 ≥99.3 ≥99.3 ICP-AES

    Packaging Details




    Particle size


    Product Features

    High thermal conductivity ;

    Low S.S.A.;

    High filling ability (for low shear machining applications)

    Thermal isotropic;

    The particle size is uniform, and the distribution is very narrow, conducive to achieve a stable match with other fillers in the application.

    Main applications

    Electronic packaging;

    High frequency power devices;

    Solid state LED lighting;

    Thermal interface materials: thermal pads, thermal silicone grease, thermally conductive paste, thermally conductive phase change materials;

    Thermal conductivity alumina-based CCL, printed circuit board prepreg;

    Thermally conductive engineering plastics.

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