Spherical Boron Nitride ceramic for thermal conductivity material

Spherical Boron Nitride ceramic for thermal conductivity material

Short Description:

With high filling ability and high mobility, the modified boron nitride has been widely used in high-end insulation and thermal conductivity materials, effectively improving the thermal conductivity of the composite system, exhibiting broad application prospects in the high-end electronic products in need of thermal management.

  • Product name: Boron Nitride powder
  • Package: aluminium foil bag
  • Color: white
  • Shape: powder
  • CAS: 10042-11-5
  • Main application: Electronic Packaging ; Thermal Interface Materials
  • MOQ: 10kg
  • Product Detail

    Product Description

    Spherical boron nitride has thermal isotropic properties, which overcomes the disadvantages of the thermal anisotropy of flake boron nitride, and can achieve good planar thermal conductivity at a lower filling ratio. It has the advantages of low density and low dielectric constant of boron nitride itself. At the same filling amount, the thermal conductivity of spherical boron nitride is more than 3 times that of flake boron nitride. Of course, we also supply boron nitride in sheets.


    Technical Item Unit HRBN Series Product Code Method/Device
    HRBN-30 HRBN-60 HRBN-100 HRBN-120 HRBN-160 HRBNL-120 HRBNL-200 HRBNL-250
    Particle Size (D50) µm 30 65 100 120 180 120 200 260 Light Scattering P-9 Light Scattering/OMEC TopSizer
    Specific Surface Area m2/g ≤4 ≤4 ≤4 ≤4 ≤4 ≤4 ≤4 ≤4 3H-2000A Specific Surface Area Anylyer
    Electrical Conductivity µS/cm ≤100 ≤100 ≤100 ≤100 ≤100 ≤100 ≤100 ≤100 Mettler FE-30 Conductivity Meter
    pH Value - ≤10 ≤10 ≤10 ≤10 ≤10 ≤10 ≤10 ≤10 Mettler FE-20 pH Meter
    Tapped Density g/cm3 0.3 0.45 0.45 0.45 0.45 0.35 0.37 0.37 BT-303
    BN % ≥99.3 ≥99.3 ≥99.3 ≥99.3 ≥99.3 ≥99.3 ≥99.3 ≥99.3 ICP-AES


    HRBNL (6)



    Particle size

    Particle size


    ● High thermal conductivity ;
    ● Low S.S.A.;
    ● High filling ability (for low shear machining applications)
    ● Thermal isotropic;
    ● The particle size is uniform, and the distribution is very narrow, conducive to achieve a stable match with other fillers in the application.


    Electronic packaging;
    High frequency power devices;
    Solid state LED lighting;
    Thermal interface materials: thermal pads, thermal silicone grease, thermally conductive paste, thermally conductive phase change materials;
    Thermal conductivity alumina-based CCL, printed circuit board prepreg;
    Thermally conductive engineering plastics.

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