Spherical boron nitride has thermal isotropic properties, which overcomes the disadvantages of the thermal anisotropy of flake boron nitride, and can achieve good planar thermal conductivity at a lower filling ratio. It has the advantages of low density and low dielectric constant of boron nitride itself. At the same filling amount, the thermal conductivity of spherical boron nitride is more than 3 times that of flake boron nitride. Of course, we also supply boron nitride in sheets.
|Technical Item||Unit||HRBN Series Product Code||Method/Device|
|Particle Size (D50)||µm||30||65||100||120||180||120||200||260||Light Scattering P-9 Light Scattering/OMEC TopSizer|
|Specific Surface Area||m2/g||≤4||≤4||≤4||≤4||≤4||≤4||≤4||≤4||3H-2000A Specific Surface Area Anylyer|
|Electrical Conductivity||µS/cm||≤100||≤100||≤100||≤100||≤100||≤100||≤100||≤100||Mettler FE-30 Conductivity Meter|
|pH Value||-||≤10||≤10||≤10||≤10||≤10||≤10||≤10||≤10||Mettler FE-20 pH Meter|
● High thermal conductivity ;
● Low S.S.A.;
● High filling ability (for low shear machining applications)
● Thermal isotropic;
● The particle size is uniform, and the distribution is very narrow, conducive to achieve a stable match with other fillers in the application.
High frequency power devices;
Solid state LED lighting;
Thermal interface materials: thermal pads, thermal silicone grease, thermally conductive paste, thermally conductive phase change materials;
Thermal conductivity alumina-based CCL, printed circuit board prepreg;
Thermally conductive engineering plastics.